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<title><![CDATA[EC21 Product Catalogs - wafer polishing slurry]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/wafer polishing slurry.html]]></link><item>
<title><![CDATA[Polishing Material for Micro Devices]]></title><link><![CDATA[https://neomond1.en.ec21.com/Polishing-Material-for-Micro-Devices--11943427_11943699.html]]></link><description><![CDATA[polishing slurry: 3, 4.5, 6, 9㎛
Increased Material Removal rate(MRR)
Improved surface polishing effect on sapphire wafers(Reduced surface roughness)
Application field
Sapphire wafer adrasive
Expect]]></description><pubDate><![CDATA[20241104]]></pubDate></item>
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<title><![CDATA[CMP Slurry Abrasive]]></title><link><![CDATA[https://bestchem00.en.ec21.com/CMP-Slurry-Abrasive--6027922_6027942.html]]></link><description><![CDATA[CMP Slurry Abrasive
In the semiconductor manufacturing process, Chemical Mechanical Polishing (CMP) is a technique used in semiconductor fabrication for planarizing the top surface of an in-process s]]></description><pubDate><![CDATA[20160127]]></pubDate></item>
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<title><![CDATA[MD&amp; RCD Diamond Polishing Slurry Grinding Polishing Liquid]]></title><link><![CDATA[https://grs51653168.en.ec21.com/MD-RCD-Diamond-Polishing--11567436_11570457.html]]></link><description><![CDATA[GRISH MD and RCD slurries consist of well-graded powders and have good dispersion. Both water and oil-based are available. Acomplete range of specifi-cations can meet various polishing requirements f]]></description><pubDate><![CDATA[20231024]]></pubDate></item>

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