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Sell Back grinding wheels for thinning process

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  • Company Name :Henan More Superhard Diamond Wheel Product
  • Membership :Free member
  • Registrarion Date :2019. 05. 21
  • CountryRegion:China
  • Address:B915 Zhongyuan Rd, Zhongyuan District, Zhengzhou, Henan,450001 China Zhengzhou Henan, China
  • Phone / Fax:86-0371-86545906  /  
  • Contact:Anna
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Description

Back grinding wheels for thinning process
More Super Hard grinding wheels are used in the grinding process for IF- series (in-feed type grinders), which use two types - one for coarse grinding, another for fine grinding.
More Super Hard combination of the grinding wheels can greatly improve the finish quality. We recommend a combination that satisfies workpiece size, required thickness and finish roughness.

Applications
Thinning process of Silicon wafers, MEMS/LED, lC/Package, Diode
Specification
Machine type: DISCO/OKAMOTOI/TSK/G&N/STRASBAUGH/LAMPMASTER ect
Wheel type: coarse/ Fine wheel
Wafer type: Bare Si waters/ Patterned si wafers/ Etched wafors/ Glass wafersRoughness: Below 0.06 um

Product marking
Application  Bond  Grit Size
    #270  #400  #600  #800  #1200  #1500  #2000  #4000
Coarse(Z1)  V(vitrified)  √  √  √  √  √  √    
Fine(Z2)  B(resinoid)          √  √  √  √

Wheel sizes
Item  Diameter(mm)  Thickness(mm)  Hole(mm)  Application Equirment
Type 1  208.7  22.20  158.00  DISCO 8”
Type 2  25.00  30.00  190.00  TSK 8”
Type 3  254.00  33.00  155.00  OKAMOTO
Type 4  282.00  31.00  228.00  STRASBAUGH
Type 5  304.00  30.40  240.00  TSK 12”
Type 6  306.00  46.20  220.00  LAPMASTER
Type 7  312.00  30.20  237.00  DISCO 12”

Manufacturing Facility
ISO9001,14001 certified
100% products inspection
Assist to improved roughness for wafer surface
Assist to modify for grinding process recipe

Spec customered
Quantity A
Price charge
Package box

Product Image

  • Sell Back grinding wheels for thinning process

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