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Sell Diamond Dicing Blade for Silicon Wafer

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  • Company Name :Zhengzhou More Superhard Diamond Wheel Product
  • Membership :Free member
  • Registrarion Date :2019. 09. 29
  • CountryRegion:China
  • Address:NO171, Zhongyuan Rd, Zhongyuan District, Zhengzhou, Henan,450001 China Zhengzhou Henan, China
  • Phone / Fax:86-0371-86545906  /  86-0371-86545906
  • Contact:Anna Wang
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Description

Diamond Dicing Blade for Silicon Wafer

1A8 Ultra-thin diamond dicing blade (over 0.75mm)
Improve chipping, blade life on hard and brittle materials
Applications: glass, quartz, LiTa03 LiNb03, QFN, splitter, sapphire, ceramic, etc

Resin bonded blades have excellent cutting ability that help reduce chippingm fractures, can efficiency improve cut quality and efficiency on ductile and gummy materials such as QFNs and coppers and on hard and brittle materials such as glass and ceramic.

Applications of diamond dicing blade
Resin Bond Diamond Dicing Blades are suitable for cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire.

How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material

DRAWING&SPECIFICATION
Grit Type  OD (mm)  ID(mm)  T(mm)  Grit Size
1A8 SD / CBN  50.8  25.4  0.07 - 0.3  #200 - #3000
  57.1  38.1    
  50.8-76.2  40    
  101.6 ,114.3  69.8    
  101.6, 114.3, 127  76.2    
  108.1, 127  88.82    
  108.1, 127  88.9    
Special size can be designed depending on customers' requirement

Spec customered
Quantity A
Price charge
Package box

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  • Sell Diamond Dicing Blade for Silicon Wafer

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