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Vertical Furnace for 300 -mm Wafers
The VF-5900 furnace is a continuation of the VF-5300 model and has been developed to welcome the new age of 300-mm silicon wafers. The VF-5900 has a batch-processing system for the mass-handling of 300-mm wafers.
Summary
The VF-5900, designed to process 300-mm wafers, can accept a stack of 12 FOUPs (Front Opening Unified Pods) and can continuously process 2 batches, each of 100 wafers. All the FOUPs loaded into the I/O port are conveyed to the buffer shelves. After that, only the FOUPs that are required are conveyed to the internal door opener. The wafers are transported in a vacuum-less environment by a highly reliable twin-arm this word means Z-theta movement robot. Ladder-type boat designed to minimize slip is a standard feature. The VF-5900 furnace uses an LGO heating element, and has a forced-cooling system to increase throughput. As an optional feature, N2 load lock can be utilized to maximize the processing capacity.
Features
Specification
| Model | VF-5900 |
| Wafer size | 300mm |
| Outside dimension(mm) | W1200 x D2750 x H3350 |
| Batch size | 100 |
| Continual treatment | 2 batch |
| Heater | LGO heater |
| Service temperature | 300 - 1050deg.-c |
| Flat zone(mm) | 1060 |
| Temperature control | 4zone |
| Cassette stock | 12 |
| Process cassette | 8 |
| Dummy cassette | 2 |
| Monitor cassette | 2 |
| Wafer transfer | vacuumless |
| Finger | 5+1 |
| Controller | Model 1400 |
| Applicable to SECS | possible |
| Applicable to AGV | possible |
| Applicable to SMIF/FOUP | possible |
A Summary of Process Performance
| Pyro.Ox Thick
film |
Pyro.Ox
Thin film |
P-D-Poly | Poly-Si | HTO | Si3N4 | TEOS | |||
| Reaction gas | O2.H2 | O2.H2 | SiH4.PH3.H2 | SiH4 | SiH2Cl2.N2O | SiH2Cl2.NH3 | Si(C2H5O)4.O2 | ||
| Growth temp.(deg.-c) | 1000 - 1250 | 800 - 1000 | 550 - 600 | 600 - 620 | 870 - 890 | 770 - 800 | - 750 | ||
| Growth rate(A/min) | - | - | 12 - 20 | 60 - 100 | 40 - 50 | 20 - 50 | - 100 | ||
| Number of wafer(sheet) | 150 | 150 | 25 | 100 | 100 | 100 | 100/50 | ||
| Thickness
variation(%) |
Inside wafer | 2 | 2 | 3 | 2 | 3 | 3 | 4 | 3 |
| Between wafers | 2 | 2 | 2 | 2 | 3 | 2 | 3 | 2 | |
| Between batches | 2 | 2 | 2 | 1 | 2 | 2 | 2 | 2 | |
| Registration Date | 2006/09/17(Year/Month/Date) |
|---|---|
| Buyer / Seller in EC21 | Seller |
| Business Type | Manufacturer |
| Year established | 1996 |
| Employees total | 11 - 50 |
| Annual revenue | USD 2,000,001 - 5,000,000 |
| Company | Koyo Thermo Systems Korea Co., Ltd. |
|---|---|
| Address | 397-4, Chupal-ri, Paengseong-eup,Pyeongtaek-siGyeonggi-do451-805 Korea |
| Phone | 82 - 31 - 6543450 |
| Fax | 82 - 31 - 6543451 |
| Homepage | http://www.ktsk.co.kr |
| Contact | Atsushi Arakawa / CEO |