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Loctite 315: thermally sensitive components, while the controlled strength permits field and service repair. The self-shimming property produces a consistent 5-6 mil gap between the component and the heat sink. ...

Bergquist Gap Filler Tgf 2000 GF2000: with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. BERGQUIST GAP FILLER 2000 is intended ...

Bergquist Hi Flow Thf 500 Hi-Flow 625: Features and Benefits 1.Thermal impedance: 0.71°C-in2 /W (25 psi) 2.Electrically isolating 3.65°C phase change compound coated on PEN film 4.Tack-free and scratch-resistant BERGQUIST Hi-Flow 625 ...

HSR-3500 Thermal Conductive Insulator: The thermal conductivity can reach 3.5w/m-k and the standard hardness is 88 shore00.Thickness is 0.25~0.5mm and the standard specification is W200mm*L200mm/sheet.Produced by our own formula, we can ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S: requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000: BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

Bergquist Sp1500st Sil-pad 1500st: BERGQUIST SP1500ST(Thermally Conductive Adhesive Tape) is a fiberglass reinforcedthermal interface material that is naturally tacky on both sides.BERGQUIST SIL-PAD 1500ST(Thermally Conductive ...

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