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Suppliers > packaging design > Shenzhen Getian Opto-electronics Co., Ltd. | Matching Products

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packaging design

" found 3 companies from Shenzhen Getian Opto-electronics Co., Ltd., China

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Flip Chip Ceramic Base COB 60W COB LED with 90 Lens: packaging. No gold wire bonding with high stability; Faster heat dissipation; low thermal resistance; Patented high pressure phosphor spray technique Overall Cost: 30 % down. (Lamp Cost; ...

Getian Flip Chip Technology LED Module 100w Cob LED with 120 Lens: packaging. No gold wire bonding with high stability; Faster heat dissipation; low thermal resistance; Patented high pressure phosphor spray technique Overall Cost: 30 % down. (Lamp Cost; ...

Getian Flip Chip High Bay Lights LEDs Flip Chip High Power 60W-200W Module with Lens: packaging. No gold wire bonding with high stability; Faster heat dissipation; low thermal resistance; Patented high pressure phosphor spray technique Overall Cost: 30 % down. (Lamp Cost; ...

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Flip Chip Ceramic Base COB 60W COB LED with 90 Lens