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JT Copper Reduction Line: Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper ...

CJM Ultra Precision Scrubbing Machine: high strength, good shock absorption and stability; 2. The body wall panels and accessories are coated with Teflon, with high hardness, rust prevention, and anti-corrosion; 3. Fully automatic ...

HM Pumex Grinding Machine: high-speed encoders work together to accurately calculate the plate length and position during HM Pumex Grinding Machine operation. At the same time, German SEW brake motors are equipped to ensure ...

SMT Reflow Ovens with Square Tower-TF2-F: Surface Mount Reflow Ovens are essential tools in modern electronics manufacturing, ensuring high precision and efficiency in soldering processes. These ovens are engineered to provide uniform heat ...

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JT Copper Reduction Line