Buy Now

Sell Now

My EC21

Search Advanced Search

Suppliers > plating > Shenzhen JuYongNeng Technology Co., Ltd | Matching Products

Your search for "

plating

" found 4 companies from Shenzhen JuYongNeng Technology Co., Ltd, China

Inquire Now

(1-4 out of 4)

JT Copper Reduction Line: Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper ...

Automatic Wafer Cleaning Device After Light Resistance: Automatic Wafer Cleaning Device After Light Resistance Product Description Application field: removal of photoresistance/wafer cleaning after grinding Wafer size: 150mm&200mm&300mm ...

CJM Ultra Precision Scrubbing Machine: plate thickness function; 4. Automatic abrasion test and automatic brushing function: 5. Automatic tracking of a certain board position, automatic control, stable grinding pressure: 6. Quick brush ...

HM Pumex Grinding Machine: plate length and position during HM Pumex Grinding Machine operation. At the same time, German SEW brake motors are equipped to ensure timely braking in various control programs to ensure forward and ...

Page 1 of 11

Go to Page Go

JT Copper Reduction Line