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JT Copper Reduction Line

JT Copper Reduction Line
Name TSP Max JT-75: 660 mm*660mm JT-85: 762 mm*762mm Min 220mm*220mm Substrate Thickness 0.05-1.2mm /0.3-6.0mm Applicable Process Copper Reduction after Horizontal ELectrolytic Plating, Copper ...

Automatic Wafer Cleaning Device After Light Resistance

Automatic Wafer Cleaning Device After Light Resistance
Automatic Wafer Cleaning Device After Light Resistance Product Description Application field: removal of photoresistance/wafer cleaning after grinding Wafer size: 150mm&200mm&300mm ...

CJM Ultra Precision Scrubbing Machine

CJM Ultra Precision Scrubbing Machine
Name TSP CJM2/4-75 S/Z CJM2/4-85 S/Z Appearance Size L1876mm*W1640mm*H1600士25mm L2437mm*W1705mm*H1600士25mm L1876mm*W1705mm*H1600士25mm L2437mm*W1640mm*H1600士25mm Max CJM214-75S/Z: ...

HM Pumex Grinding Machine

HM Pumex Grinding Machine
Name TSP HM3/6-75 S/Z HM3/6-85 S/Z Appearance Size L2247mm*W1600mm*H1400士25mm L2887mm*W1600mm*H1400士25m L2247mm*W1700mm*H1400士25mm L2887mm*W1700mm*H1400土25mm Max HM3/6-75S/Z:660mm*660mm HM3/6-85 ...

SMT Reflow Ovens with Square Tower-TF2-F

SMT Reflow Ovens with Square Tower-TF2-F
Surface Mount Reflow Ovens are essential tools in modern electronics manufacturing, ensuring high precision and efficiency in soldering processes. These ovens are engineered to provide uniform heat ...
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