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Suppliers > electronic materials > Henan HuanYuChang Electronic Technology Co.,Ltd. | Matching Products
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electronic materials

" found 6 companies from Henan HuanYuChang Electronic Technology Co.,Ltd., Hong Kong
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(1-6 out of 6)

Hot Press Laminate TPX Film (Adhesive Barrier Release Film)

This company has a company video.
Hot Press Laminate TPX Film (Adhesive Barrier Release Film)
Application TPX Film (Adhesive barrier Release Film) is a functional film specially designed to control or prevent the penetration or overflow of adhesives (such as epoxy resin, acrylic glue, etc.). ...

4120 Hardening Steel Separator Plate

This company has a company video.
4120 Hardening Steel Separator Plate
material, the 4120 laminated steel plate can provide stable support for other components in the laminated structure. During the lamination process, it can ensure the accurate relative positions of ...

PCB Lamination Process Materials Press Pad Cushion

This company has a company video.
PCB Lamination Process Materials Press Pad Cushion
materials, and is carefully compounded with high - molecular polymers, fully demonstrating its high quality. Feature and Application It is mainly used in the lamination processes of CCL, ...

280 Celsius Hard Laminated Cushion

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280 Celsius Hard Laminated Cushion
material and high molecular polymer. It has excellent high temperature resistance, tear resistance, shock absorption and buffering protection performance. Feature and Application It is mainly used ...

230 Degrees Celsius Soft Laminated Cushion

This company has a company video.
230 Degrees Celsius Soft Laminated Cushion
materials, and high - molecular polymers, and it has excellent performance. Feature and Application It is mainly used in lamination processes for CCL, aluminum-based substrates, PCB, HDI, ...

PCB Lamination Cushion Pad

This company has a company video.
PCB Lamination Cushion Pad
materials, and is carefully compounded with high - molecular polymers, fully demonstrating its high quality. 3.Feature and Application It is mainly used in the lamination processes of CCL, ...
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