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Suppliers > package > Standard Systems | Matching Products
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" found 10 companies from Standard Systems, Korea
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(1-10 out of 10)

LQFP; Low Profile Quad Flat Package

LQFP; Low Profile Quad Flat Package
LQFP /Low Profile Quad Flat Pack Note : Power Quad 2 & 4 LQFP, ExposedPad LQFP are also available. LQFP : Body Size : Smallest 7mmx7mm, Largest : 28mmx28mm Body Thickness :1.4mm Lead Form : 1.0mm ...

PDIP, SPDIP. Dual-In-Line Packages

PDIP, SPDIP. Dual-In-Line Packages
PDIP , SPDIP /(Shrink) Plastic Dual In Line PDIP : 300MIL/ 8LD ~28LD ,400MIL /22LD,600MIL /24LD~48LD SPDIP : 400MIL/ 30LD~32LD,600MIL/ 42LD ~56LD,750MIL/ ...

Semiconductor Assembly & Packaging Services

Semiconductor Assembly & Packaging Services
Standard Systems provide semiconductor packaging services to assemble die in wafer form to various package types :BGA,QFP,SO,QFN,PLCC, SOIC, PDIP, Etc...... Willing to work for Fabless and IC Design ...

Semiconductor Assembly & Packaging Services

Semiconductor Assembly & Packaging Services
Standard Systems company Provide semiconductor packaging services to assemble die in wafer form to various package types :BGA,QFP,SO,QFN...... Willing to work for Fabless and IC Design companies can ...

IC Packaging(IC Assembly,Dummy Components Build)

IC Packaging(IC Assembly,Dummy Components Build)
Standard Systems have been providing Semiconductor Assembly Services to IC design companies or Fabless companies since 1996. We use good sub- contractors in Korea and other Asia area for IC assembly ...

TSOP(I). Thin Small Outline

TSOP(I). Thin Small Outline
Click to enlarge image ( Dummy Component;Mechanical IC ) TSOP(I) / Thin Small Outline (Type I) TSOP(I) : Body Size : Smallest 8x11.8mm, Largest : 12mmx18.4mm Body Thickness :1.0mm Lead Count : ...

PLCC. Plastic Leaded Chip Carrier

PLCC. Plastic Leaded Chip Carrier
Click to enlarge image ( Dummy Component;Mechanical IC ) PLCC / Plastic Leaded Chip Carrier Body Size : Smallest .352” x.352” , Largest : 1.152” x1.152” Body Thickness : ...

IC Assembly Services for Fabless Companies

IC Assembly Services for Fabless Companies
Standard Systems, Working at IC Assembly Service company have been providing Semiconductor Assembly Services to IC Design and Fabless companies, and also supplying components to world wide ...

QFN Lead Frame Strips with Mold Cap

QFN Lead Frame Strips with Mold Cap
Standard Systems can also build Small volume to Medium-Large amount order after prototype. We can supply BGA substrates with mold encapsulation for blade sawing test and solder ball attach or solder ...

Dummy QFN Lead Frame Strip with Mold Encapsulation

Dummy QFN Lead Frame Strip with Mold Encapsulation
Standard Systems can also build Small volume to Medium amount order after prototype. We can supply Molded Dummy QFN strips for saw blade test(QFN strips with mold encapsulation). The unit sizes are ...
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