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New NDT Systems Bondascope 3100 Ultrasonic Bond

New NDT Systems Bondascope 3100 Ultrasonic Bond
temperature15 F to 105 F (-10 C to 40 C)Alarmsbox, polar and up to 8 individual and individually sizeable “ring gates” centered at stored reference dot locations in impedance plane operation. ...

New Olympus BondMaster 600 Multimode Bond Tester

New Olympus BondMaster 600 Multimode Bond Tester
Temperature–10 °C to 50 °C (50 °F to 122 °F) Storage Temperature0 °C to 50 °C (32 °F to 122 °F) [with batteries] and -20 °C to 70 °C (-4 °F to 158 °F) [without batteries] IP RatingDesigned to meet ...
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