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New NDT Systems Bondascope 3100 Ultrasonic Bond

New NDT Systems Bondascope 3100 Ultrasonic Bond
Mechanical Impedance Analysis (MIA), and Resonance modes for evaluation of composite and laminated test samples. This handheld instrument is a valuable tool for the evaluation of first article ...

New Olympus BondMaster 600 Multimode Bond Tester

New Olympus BondMaster 600 Multimode Bond Tester
mechanical impedance analysis (MIA) method. Portable, Lightweight, and ErgonomicThe ergonomic design of the BondMaster 600 is convenient for difficult-to-access inspection locations. For inspection ...
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