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New NDT Systems Bondascope 3100 Ultrasonic Bond

New NDT Systems Bondascope 3100 Ultrasonic Bond
testing modes to cover a range of applications, utilizing Pitch-catch, Mechanical Impedance Analysis (MIA), and Resonance modes for evaluation of composite and laminated test samples. This handheld ...

New Olympus BondMaster 600 Multimode Bond Tester

New Olympus BondMaster 600 Multimode Bond Tester
Testing Specifications (All BondMaster Models)Probe Connectors11-pin Fischer Gain*0 dB to 100 dB in 0.1 or 1 dB increments Rotation*0° to 359.9° in 0.1° or 1° increments Scan View*Variable from 0.520 ...
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