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copper clad laminate

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DABPA, ODABPA, Di-Allyl-Bisphenol-A, Cas No. 1745-89-7

DABPA, ODABPA, Di-Allyl-Bisphenol-A, Cas No. 1745-89-7
It is mainly used for the modification of Bismaleimide (BMI), which can greatly reduce the application cost of BMI resin and improve the handleability and processability of BMI resin. Improve the ...

HPCTP, Phenoxy Cyclophosphazene, CAS No. 1184-10-7

HPCTP, Phenoxy Cyclophosphazene, CAS No. 1184-10-7
White or yellowish crystalline powder, non-irritating odor, is an additive flame retardant. Soluble in solvents such as toluene, chlorobenzene and acetone, slightly soluble in methanol, insoluble in ...
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