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AW-2001R Microwave Plasma Etcher

AW-2001R Microwave Plasma Etcher
Lines: 4 LinesFree Fast Quote: Link Downloads: AW-2001R (PDF) Please find the info on our production proven equipment and upgrade kits. Allwin21 Brochures: Rapid Thermal ProcessorsAllwin21 Brochures: ...

AW-B3000 Barrel Plasma Asher Descum

AW-B3000 Barrel Plasma Asher Descum
Lines: 1-3 LinesDimensions:W:27.25″ D:33″ H:24.75”(Main Body)Main Customers: Link Free Fast Quote: Link Please find the info on our production proven equipment and upgrade kits. Allwin21 Brochures: ...

AW-105R Plasma Asher Plasma Descum

AW-105R Plasma Asher Plasma Descum
Lines: 1-3 Lines MFCs. Typical gases are 5 SLM O2, 500 SCCM O2,1000 SCCM N2.Main Customers: Link Free Fast Quote: Link Please find the info on our production proven equipment and upgrade ...

AW-1008 Plasma Asher Semiconductor Process Equipment

AW-1008 Plasma Asher Semiconductor Process Equipment
Manufacturer: Allwin21Condition: NewWafer Size: 3″ – 6″ CapabilityWafer Loading: 3-axis Robot wafer transfer (Video)Plasma Power: MicrowaveType: Parallel/Single Wafer Process; Stand-AloneGas Lines: ...

AccuSputter AW 4450 Sputter Deposition System

AccuSputter AW 4450 Sputter Deposition System
Lines: 1~3 MFCsTable Rotate/Lift Subsystem: Feed-thru assembly (Option) Main Customers: Link Free Fast Quote: Link Allwin21 Corp. has been focusing on providing solutions and enhancements to ...

AccuThermo AW 820 Rapid Thermal Annealer

AccuThermo AW 820 Rapid Thermal Annealer
linesOptions: Integrated solid robotic wafer transfer ; SMIF (Standard Mechanical Interface) load port transfer. Add Double O Ring and/or O2 Sensor/Analyzer for O2 sensitive applications and saving ...

AccuThermo AW 610M Rapid Thermal Annealing

AccuThermo AW 610M Rapid Thermal Annealing
Lines: MFCs, 6 lines capability .Typically, Nitrogen (N2), oxygen (O2), argon (Ar), helium (He) , Forming Gases, NH3, N2O2 etc. are used. Chamber Design: 40-years-proven Heating chamber’s cold-wall ...

AccuThermo AW 610M Rapid Thermal Process

AccuThermo AW 610M Rapid Thermal Process
Lines: MFCs, 6 lines capability .Typically, Nitrogen (N2), oxygen (O2), argon (Ar), helium (He) , Forming Gases, NH3, N2O2 etc. are used. Chamber Design: 40-years-proven Heating chamber’s cold-wall ...
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