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Products > resin pad. > Shenzhen Hothree Technology Co., Ltd | Similar Products
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resin pad.

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Bergquist Gap Pad Tgp 3500ulm

Bergquist Gap <strong>Pad</strong> Tgp 3500ulm
FEATURES AND BENEFITS1. Thermal Conductivity: 3.5 W/m-K2.Fiberglass reinforced for shear and tear resistance 3.Non-fiberglass option for applications that require an additional reduction in ...

Gap Pad TGP 3000 Gap Pad 3000S30 BERGQUIST GP3000S30

Gap <strong>Pad</strong> TGP 3000 Gap <strong>Pad</strong> 3000S30 BERGQUIST GP3000S30
BERGQUIST GP3000S30,Gap Pad 3000S30 Gap Pad 3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due ...
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