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Products > thermal interface materials > Shenzhen Hothree Technology Co., Ltd | Similar Products
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thermal interface materials

" found 6 Products from Shenzhen Hothree Technology Co., Ltd, China
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(1-6 out of 6)

Bergquist Gap Pad Tgp 3500ulm

Bergquist Gap Pad Tgp 3500ulm
material with a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin ...

Bergquist GF3500S35,GAP FILLER 3500S35 Gap Filler TGF 3600 Thermal Paste

Bergquist GF3500S35,GAP FILLER 3500S35 Gap Filler TGF 3600 Thermal Paste
material maintains good thixotropic characteristics as well as low viscosity. The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external ...

Gap Pad TGP 3000 Gap Pad 3000S30 BERGQUIST GP3000S30

Gap Pad TGP 3000 Gap Pad 3000S30 BERGQUIST GP3000S30
BERGQUIST GP3000S30,Gap Pad 3000S30 Gap Pad 3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due ...

Bergquist HF300P HI-FLOW 300P Hi-flow Thf 1600p

Bergquist HF300P HI-FLOW 300P Hi-flow Thf 1600p
Bergquist HF300P HI-FLOW 300P Hi-flow Thf 1600p BERGQUIST HI-FLOW THF 1600P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film. The ...

Honeywell PCM45F PCM45F-SP

Honeywell PCM45F PCM45F-SP
• High performance filler and polymer technology• Phase change at 45°C• Highly conductive filler loading to optimize performance• Superior handling and reworkability • Superior reliable thermal ...

Bergquist Hf225ut Hi-flow 225ut Hi-flow Thf 700ut

Bergquist Hf225ut Hi-flow 225ut Hi-flow Thf 700ut
BERGQUIST HI-FLOW THF 700UT is designed as a pressure-sensitive thermalinterface material for use between a high performance processor and a heat sink.BERGQUIST HI-FLOW 225UT is a thermally ...
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