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PCB - Hdi: 100 μm • Minimum: 50 μm (HDI/laser process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser Via) Micro ...

PCB - Rigid Flex: 100 μm • Minimum: 50 μm (HDI/laser process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser Via) Micro ...

PCB - Flex: 100 μm • Minimum: 50 μm (laser process/advanced specifications) The finer the material, the greater the impact on cost and yield. Layer Count • 1~2 Layers (Single/Double Flex) • Multi-layer Flex: ...

PCB - Multi-Layer: PCB - Multi-Layer Description A multilayer printed circuit board (PCB) is a PCB made by laminating three or more layers (typically four, six, or eight or more) of copper foil with an insulating layer ...

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