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PCB - Hdi: 75–100 μm • Minimum: 50 μm (HDI/laser process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser ...

PCB - Rigid Flex: 75–100 μm • Minimum: 50 μm (HDI/laser process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser ...

PCB - Flex: 75–100 μm • Minimum: 50 μm (laser process/advanced specifications) The finer the material, the greater the impact on cost and yield. Layer Count • 1~2 Layers (Single/Double Flex) • Multi-layer Flex: ...

PCB - Multi-Layer: 75 μm or less (HDI process) Influencing factors Manufacturing difficulty, cost, and yield Via Specifications • Through Via (PTH): General Purpose • Blind/Buried Via: High-Density Design • Micro Via ...

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