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Manufacturing Processing

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PCB - Multi-Layer

PCB - Multi-Layer
process) Influencing factors Manufacturing difficulty, cost, and yield Via Specifications • Through Via (PTH): General Purpose • Blind/Buried Via: High-Density Design • Micro Via (HDI): ...

PCB - Single Sided

PCB - Single Sided
manufacturing difficulty • Standard low-cost specification: 200μm • Minimum possible specification: 100μm Single-sided PCBs have a single wiring layer, so smaller lines/spacing increases design ...
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