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PCB - Hdi

PCB - Hdi
General for Rigid Areas • Thickness: 0.5 to 1 oz (Flex), Up to 2 oz (Rigid) RA Copper is required for repetitive bending areas Lines & Spaces • Standard: 75–100 μm • Minimum: 50 μm (HDI/laser ...

PCB - Rigid Flex

PCB - Rigid Flex
General for Rigid Areas • Thickness: 0.5 to 1 oz (Flex), Up to 2 oz (Rigid) RA Copper is required for repetitive bending areas Lines & Spaces • Standard: 75–100 μm • Minimum: 50 μm (HDI/laser ...

PCB - Multi-Layer

PCB - Multi-Layer
generation Copper Weight • Outer Layer: 0.5 to 1 oz (typical), up to 2 oz • Inner Layer: 0.5 to 1 oz Selection criteria • Signal Layer: Thin (impedance-precise) • Power Layer: Thick (current- and ...

PCB - Double Sided

PCB - Double Sided
General Specifications: 1 oz / 2 oz (per ft²) • Directly affects current capacity and heat dissipation characteristics Selection criteria • Signal/Control Circuits: 1 oz • Power/High-Current Lines: 2 ...

PCB - Single Sided

PCB - Single Sided
Power/high-current circuits → 2 oz or more Lines & Spaces Determines circuit density and manufacturing difficulty • Standard low-cost specification: 200μm • Minimum possible specification: ...
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