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Products > Process control > Seil | Similar Products

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Process control

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PCB - Hdi: process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser Via) Micro Via is used for high-density, ...

PCB - Rigid Flex: process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser Via) Micro Via is used for high-density, ...

PCB - Multi-Layer: control, heat generation Copper Weight • Outer Layer: 0.5 to 1 oz (typical), up to 2 oz • Inner Layer: 0.5 to 1 oz Selection criteria • Signal Layer: Thin (impedance-precise) • Power Layer: Thick ...

PCB - Single Sided: control and power circuits. Surface Finish This process affects solderability, storability, and cost. LF HASL(Lead-Free HASL) • Excellent solderability for the price • Most widely used OSP • Low cost ...

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