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PCB - Hdi

PCB - Hdi
General for Rigid Areas • Thickness: 0.5 to 1 oz (Flex), Up to 2 oz (Rigid) RA Copper is required for repetitive bending areas Lines & Spaces • Standard: 75–100 μm • Minimum: 50 μm (HDI/laser ...

PCB - Rigid Flex

PCB - Rigid Flex
General for Rigid Areas • Thickness: 0.5 to 1 oz (Flex), Up to 2 oz (Rigid) RA Copper is required for repetitive bending areas Lines & Spaces • Standard: 75–100 μm • Minimum: 50 μm (HDI/laser ...

PCB - Flex

PCB - Flex
structure. High-density implementation possible with laser vias. Surface Finish • ENIG: Excellent flatness, solderability, and reliability (recommended) • OSP: Low cost, short-term use • Im Tin / Im ...

PCB - Multi-Layer

PCB - Multi-Layer
General Purpose • Blind/Buried Via: High-Density Design • Micro Via (HDI): Ultra-High-Density Design Selection Guide Micro/Blind Via Utilization for Area-Saving and High-Speed Designs Stack-up ...

PCB - Double Sided

PCB - Double Sided
General Specifications: 1 oz / 2 oz (per ft²) • Directly affects current capacity and heat dissipation characteristics Selection criteria • Signal/Control Circuits: 1 oz • Power/High-Current Lines: 2 ...
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