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Printed Circuit Board Assembly(PCBA)

Printed Circuit Board Assembly(PCBA)
main process Surface Mount Technology • Surface-mount component mounting, including chip components, ICs, BGAs, and QFNs. • Solder paste printing → component mounting → reflow ...

PCB - Hdi

PCB - Hdi
Radius • Static bending: 6 to 10 times the thickness • Dynamic bending: 10 to 20 times the thickness Risk of cracks and short circuits if radius is not observed Electrical Test • 100% BBT ...

PCB - Rigid Flex

PCB - Rigid Flex
Radius • Static bending: 6 to 10 times the thickness • Dynamic bending: 10 to 20 times the thickness Risk of cracks and short circuits if radius is not observed Electrical Test • 100% BBT ...

PCB - Multi-Layer

PCB - Multi-Layer
Excellent flatness and reliability (recommended) • OSP: Low cost and short-term use • Im Silver / Im Tin: Focus on flatness Solder Mask • Colors: Green, Black, White, etc. • Green: Highest stability ...

PCB - Double Sided

PCB - Double Sided
PCBs → LF HASL / OSP. Solder Mask Responsible for circuit protection and appearance quality. Colors • Green, White, Black, Blue, Red, Yellow Green is the most stable and cost-effective Electrical ...
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