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Products > laser items > Seil | Similar Products

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PCB - Hdi: laser process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser Via) Micro Via is used for high-density, ...

PCB - Rigid Flex: laser process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser Via) Micro Via is used for high-density, ...

PCB - Flex: laser vias. Surface Finish • ENIG: Excellent flatness, solderability, and reliability (recommended) • OSP: Low cost, short-term use • Im Tin / Im Silver: Special applications Bending Radius • ...

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