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PCB - Hdi: m • Minimum: 50 μm (HDI/laser process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser Via) Micro Via is ...

PCB - Rigid Flex: m • Minimum: 50 μm (HDI/laser process) The finer the material, the greater the impact on cost and yield. Via Specifications • Through Via (PTH) • Blind/Buried Via • Micro Via (Laser Via) Micro Via is ...

PCB - Flex: m • Minimum: 50 μm (laser process/advanced specifications) The finer the material, the greater the impact on cost and yield. Layer Count • 1~2 Layers (Single/Double Flex) • Multi-layer Flex: High-end ...

PCB - Multi-Layer: m • Minimum: 75 μm or less (HDI process) Influencing factors Manufacturing difficulty, cost, and yield Via Specifications • Through Via (PTH): General Purpose • Blind/Buried Via: High-Density ...

PCB - Double Sided: m • Minimum Possible Specification: 100 μm Double-sided PCBs utilize vias to distribute wiring, making it easier to implement finer patterns than single-sided PCBs. Layer Count • 2 Layer(Top / ...

PCB - Single Sided: m • Minimum possible specification: 100μm Single-sided PCBs have a single wiring layer, so smaller lines/spacing increases design freedom, but also increases cost. Layer Count • 1 Layer Since wiring ...

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