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Intermediate for Copper Plating

Intermediate for Copper Plating
For Copper plating: DPS (N,N-dimethyl-dithiocarbamyl propyl sulfonic acid, sodium salt, CAS No:18880-36-9) Q75 [N,N, N?,N?-Tetrakis(2-hydroxypropyl)ethylenediamine] JPH (EXPO2887) (Aqueous of ...

Intermediates for Metal Surface Treatment

Intermediates for Metal Surface Treatment
Chloral hydrate ALS 25% &35% & 95%(Sodium allyl sulfonate,CAS No: 2495-39-8) ATP ( Carboxyethylisothiuronium chloride, CAS No: 5425-78-5) BBI [Bis (benzene sulphonyl)-imide, CAS No:2618-96-4] ...
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