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Products > Applicators > Qingdao Docbond New Material Co.,Ltd | Similar Products

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DOCBOND|High Thermal Conductivity Epoxy Adhesive: This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, ...

DOCBOND|Two-component Structural Adhesive: This series of products have high structural bonding strength. In the shear strength test in the laboratory, the bonding property of this product is stronger than that of steel strip. The product is ...

DOCBOND|UV Cure Adhesive: This product is a one component UV curing adhesive with excellent adhesion to PC, PMMA, glass and other substrates. It has the characteristics of high bonding strength, low volatility, low shrinkage, ...

DOCBOND|In-Mold Injection Adhesive: DB1109 This product is a single coating adhesive. It can be dried at a low temperature and then cured at a high temperature to adapt to the bonding of various substrates. Such as: PVC, ABS, PMMA, PC, ...

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate: The application of this series of product in hydrogen fuel electric reactor is：double plate water bonding The product is a single component，high temperature resistance，activated epoxy resin，on a ...

DOCBOND|sealant for Gas Path of Fuel Cell Bipolar Plate: The application of this series of products in hydrogen fuel electric reactor is：double plate gas-path adhesive seal，instead of the traditional seal ring This product is a single component，thermally ...

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DOCBOND|High Thermal Conductivity Epoxy Adhesive