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Products > chip > Qingdao Docbond New Material Co.,Ltd | Similar Products

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DOCBOND|High Thermal Conductivity Epoxy Adhesive: This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, ...

DOCBOND|Conductive Adhesive: This product is a single component epoxy conductive adhesive with Conductive material as the medium. It is characterized by high purity, high conductivity, low modulus and long service life. The ...

DOCBOND|Underfill DB840B: DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by ...

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DOCBOND|High Thermal Conductivity Epoxy Adhesive