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DOCBOND|Underfill DB840B

DOCBOND|Underfill DB840B
DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by ...

DOCBOND|Composite Graphite Bipolar Plate

DOCBOND|Composite Graphite Bipolar Plate
adhesive and gas path sealant used in the production process are independently developed and have a number of invention patents, with strong core competitiveness The function of the bipolar plate is ...

DOCBOND|microporous Plugging Agent for Graphite Bipolar Plate

DOCBOND|microporous Plugging Agent for Graphite Bipolar Plate
Microporous plugging agent for graphite bipolar plate of fuel cell This series of product are used for impregnation and filling of bipolar plate in hydrogen fuel electric reactor. tightness,chemical ...
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