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Products > substrate > Qingdao Docbond New Material Co.,Ltd | Similar Products

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DOCBOND|UV Cure Adhesive: This product is a one component UV curing adhesive with excellent adhesion to PC, PMMA, glass and other substrates. It has the characteristics of high bonding strength, low volatility, low shrinkage, ...

DOCBOND|In-Mold Injection Adhesive: DB1109 This product is a single coating adhesive. It can be dried at a low temperature and then cured at a high temperature to adapt to the bonding of various substrates. Such as: PVC, ABS, PMMA, PC, ...

DOCBOND|Underfill DB840B: DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by ...

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate: The application of this series of product in hydrogen fuel electric reactor is：double plate water bonding The product is a single component，high temperature resistance，activated epoxy resin，on a ...

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DOCBOND|UV Cure Adhesive