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Bergquist Gap Filler Tgf 2000 GF2000

Bergquist Gap Filler Tgf <strong>2000</strong> GF<strong>2000</strong>
Features and Benefits 1. Thermal conductivity: 2.0 W/m-K2. Ultra-conforming; designed for fragile and low-stress applications 3.Ambient and accelerated cure schedules 4.100% solids – no cure ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000

BERGQUIST Q-Pad 3  SIL PAD TSP Q<strong>2000</strong>
BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

HSR-3500 Thermal Conductive Insulator

HSR-3500 Thermal Conductive Insulator
The thermal conductivity can reach 3.5w/m-k and the standard hardness is 88 shore00.Thickness is 0.25~0.5mm and the standard specification is W200mm*L200mm/sheet.Produced by our own formula, we can ...
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