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BERGQUIST Q-Pad 3 SIL PAD TSP Q2000: BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

Loctite AA 3491: 1.1-part system2.High transparency and low yellowing3.Medium viscosity4.Well suited to plastics, glass and metals5.Suitable for ceramics High transparency, low yellowing, medium viscosity light-cure ...

Bergquist Hi-flow 565ut: BERGQUIST HI-FLOW THF 3000UT Features and Benefits• Thermal impedance: 0.05°C-in.2/W(at 25 psi)• High thermal conductivity: 3.0 W/mk• Phase change softening temperature52°C• Naturally tacky• ...

Bergquist Gap Filler Tgf 2000 GF2000: Features and Benefits 1. Thermal conductivity: 2.0 W/m-K2. Ultra-conforming; designed for fragile and low-stress applications 3.Ambient and accelerated cure schedules 4.100% solids – no cure ...

Bergquist Hi Flow Thf 500 Hi-Flow 625: Features and Benefits 1.Thermal impedance: 0.71°C-in2 /W (25 psi) 2.Electrically isolating 3.65°C phase change compound coated on PEN film 4.Tack-free and scratch-resistant BERGQUIST Hi-Flow 625 ...

HSR-3500 Thermal Conductive Insulator: hothree HSR-3500 (thermal conductive insulator) is a pure boron nitride filled and has high thermal conductivity, ultra-high voltage resistance,low density and low dielectric properties. The material ...

Bergquist Gap Pad Tgp 7000ulm: FEATURES AND BENEFITS 1.Thermal Conductivity: 7 W/m-K 2.High-compliance, low compression stress 3.Ultra low modulus PRODUCT DESCRIPTIONA 7 W/m-K, extremely soft Gap Pad with exceptional thermal ...

Laird Tflex 600 Thermal Gap Filler: FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...

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