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Products > IDEAL > Hothree Technology | Similar Products

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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0: BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II: BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electricallyconductive SIL PAD rubber. The material is designed for those applications in which ...

Bergquist Gap Filler Tgf 2000 GF2000: ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won’t pump from the ...

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