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" in Insulation Materials & Elements found 7 Products from Hothree Technology, China

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Bergquist Hi-flow 565ut: 52°C. The phase change softening featureimproves handling characteristics prior to a facilitated assembly. At application temperatures andpressures, BERGQUIST HI-FLOW 565UT wets out the thermal ...

Loctite 315: Technology:AcrylicChemical Type:AcrylicAppearance (uncured):Blue pasteComponents:One component - requires no mixingViscosity:HighCure:ActivatorApplication:Bonding Henkel LOCTITE 315 300ML is a ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS: BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling PadGAP PAD TGP 1000VOUS, Silicone Thermal Pad For ConverterGAP PAD VO Ultra Soft Interface Pad Heat Transfer MaterialsBERGQUIST GAP PAD ...

Bergquist Gap Filler Tgf 2000 GF2000: heat sink. Before cure, it flows under pressure like grease. After cure, it won’t pump from the interface as a result of thermal cycling and is dry to the touch. Unlike cured gap-filling materials, ...

Bergquist Hi Flow Thf 500 Hi-Flow 625: Features and Benefits 1.Thermal impedance: 0.71°C-in2 /W (25 psi) 2.Electrically isolating 3.65°C phase change compound coated on PEN film 4.Tack-free and scratch-resistant BERGQUIST Hi-Flow 625 ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000: BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

Bergquist Sp1500st Sil-pad 1500st: BERGQUIST SP1500ST(Thermally Conductive Adhesive Tape) is a fiberglass reinforcedthermal interface material that is naturally tacky on both sides.BERGQUIST SIL-PAD 1500ST(Thermally Conductive ...

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