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(1-13 out of 13)

Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0

Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0
BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Loctite AA 3491

Loctite AA 3491
cures in seconds upon exposure to ultraviolet radiation of 365nm to form an impact resistant bond which exhibits excellent resistance to prolonged humidity or water immersion. Typical applications ...

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II
BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electricallyconductive SIL PAD rubber. The material is designed for those applications in which ...

Bergquist Hi-flow 565ut

Bergquist Hi-flow 565ut
BERGQUIST HI-FLOW THF 3000UT Features and Benefits• Thermal impedance: 0.05°C-in.2/W(at 25 psi)• High thermal conductivity: 3.0 W/mk• Phase change softening temperature52°C• Naturally tacky• ...

Loctite 315

Loctite 315
Technology:AcrylicChemical Type:AcrylicAppearance (uncured):Blue pasteComponents:One component - requires no mixingViscosity:HighCure:ActivatorApplication:Bonding Henkel LOCTITE 315 300ML is a ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS
BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling PadGAP PAD TGP 1000VOUS, Silicone Thermal Pad For ConverterGAP PAD VO Ultra Soft Interface Pad Heat Transfer MaterialsBERGQUIST GAP PAD ...

Bergquist Gap Filler Tgf 2000 GF2000

Bergquist Gap Filler Tgf 2000 GF2000
Features and Benefits 1. Thermal conductivity: 2.0 W/m-K2. Ultra-conforming; designed for fragile and low-stress applications 3.Ambient and accelerated cure schedules 4.100% solids – no cure ...

Bergquist Hi Flow Thf 500 Hi-Flow 625

Bergquist Hi Flow Thf 500 Hi-Flow 625
of the coating material eliminates shipping and handling problems. The PEN film has a continuous use temperature of 150°C.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature ...

HSR-3500 Thermal Conductive Insulator

HSR-3500 Thermal Conductive Insulator
hothree HSR-3500 (thermal conductive insulator) is a pure boron nitride filled and has high thermal conductivity, ultra-high voltage resistance,low density and low dielectric properties. The material ...

Bergquist Gap Pad Tgp 7000ulm

Bergquist Gap Pad Tgp 7000ulm
FEATURES AND BENEFITS 1.Thermal Conductivity: 7 W/m-K 2.High-compliance, low compression stress 3.Ultra low modulus PRODUCT DESCRIPTIONA 7 W/m-K, extremely soft Gap Pad with exceptional thermal ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S
The true workhorse of the SIL PAD product family, SIL PAD900S AC (BERGQUIST SP900S AC)thermally conductive insulation material is designed for a wide variety of applications requiring high thermal ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000
BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

Laird Tflex 600 Thermal Gap Filler

Laird Tflex 600 Thermal Gap Filler
FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...
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