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Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II
BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electricallyconductive SIL PAD rubber. The material is designed for those applications in which ...

Bergquist Hi Flow Thf 500 Hi-Flow 625

Bergquist Hi Flow Thf 500 Hi-Flow 625
coated on PEN film. BERGQUIST HF625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink. The reinforcement makes ...

Laird Tflex 600 Thermal Gap Filler

Laird Tflex 600 Thermal Gap Filler
FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...
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