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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0: BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Loctite AA 3491: cures in seconds upon exposure to ultraviolet radiation of 365nm to form an impact resistant bond which exhibits excellent resistance to prolonged humidity or water immersion. Typical applications ...

Loctite 315: Technology:AcrylicChemical Type:AcrylicAppearance (uncured):Blue pasteComponents:One component - requires no mixingViscosity:HighCure:ActivatorApplication:Bonding Henkel LOCTITE 315 300ML is a ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS: BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling PadGAP PAD TGP 1000VOUS, Silicone Thermal Pad For ConverterGAP PAD VO Ultra Soft Interface Pad Heat Transfer MaterialsBERGQUIST GAP PAD ...

Bergquist Gap Filler Tgf 2000 GF2000: components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won’t pump from the interface as a result of thermal cycling ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S: The true workhorse of the SIL PAD product family, SIL PAD900S AC (BERGQUIST SP900S AC)thermally conductive insulation material is designed for a wide variety of applications requiring high thermal ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000: BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

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