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Bergquist Hi-flow 565ut: 52°C. The phase change softening featureimproves handling characteristics prior to a facilitated assembly. At application temperatures andpressures, BERGQUIST HI-FLOW 565UT wets out the thermal ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS: dampening and shockabsorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and ...

Bergquist Gap Filler Tgf 2000 GF2000: with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. BERGQUIST GAP FILLER 2000 is intended ...

Bergquist Hi Flow Thf 500 Hi-Flow 625: of the coating material eliminates shipping and handling problems. The PEN film has a continuous use temperature of 150°C.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature ...

HSR-3500 Thermal Conductive Insulator: hothree HSR-3500 (thermal conductive insulator) is a pure boron nitride filled and has high thermal conductivity, ultra-high voltage resistance,low density and low dielectric properties. The material ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S: requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of ...

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