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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0: requiring low stress on components and boards during assembly. BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable nature that allows for excellent interfacing ...

Bergquist Hi-flow 565ut: BERGQUIST HI-FLOW THF 3000UT Features and Benefits• Thermal impedance: 0.05°C-in.2/W(at 25 psi)• High thermal conductivity: 3.0 W/mk• Phase change softening temperature52°C• Naturally tacky• ...

Bergquist Gap Pad Tgp 7000ulm: ease of use.TYPICAL APPLICATIONS● Telecommunications (routers, switches, base stations) ● Optical transceivers ● ASICs and DSPs TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties Hardness, ...

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