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Bergquist Gap Filler Tgf 2000 GF2000

Bergquist Gap Filler Tgf 2000 GF2000
electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won’t pump from the interface as a result of ...

Bergquist Hi Flow Thf 500 Hi-Flow 625

Bergquist Hi Flow Thf 500 Hi-Flow 625
Features and Benefits 1.Thermal impedance: 0.71°C-in2 /W (25 psi) 2.Electrically isolating 3.65°C phase change compound coated on PEN film 4.Tack-free and scratch-resistant BERGQUIST Hi-Flow 625 ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000

BERGQUIST Q-Pad 3  SIL PAD TSP Q2000
BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

Bergquist Sp1500st Sil-pad 1500st

Bergquist Sp1500st Sil-pad 1500st
BERGQUIST SP1500ST(Thermally Conductive Adhesive Tape) is a fiberglass reinforcedthermal interface material that is naturally tacky on both sides.BERGQUIST SIL-PAD 1500ST(Thermally Conductive ...
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