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Products > electronical component > Hothree Technology | Similar Products

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electronical component

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Loctite 315: components to heat sinks with an insulating gap. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and ...

Bergquist Gap Filler Tgf 2000 GF2000: component, room or elevated temperature curing system. The material provides a balance of cured material properties and good compression set (memory). The result is a soft, form-in place elastomer ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S: requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000: BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

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