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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0: BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Bergquist Gap Filler Tgf 2000 GF2000: Features and Benefits 1. Thermal conductivity: 2.0 W/m-K2. Ultra-conforming; designed for fragile and low-stress applications 3.Ambient and accelerated cure schedules 4.100% solids – no cure ...

HSR-3500 Thermal Conductive Insulator: hothree HSR-3500 (thermal conductive insulator) is a pure boron nitride filled and has high thermal conductivity, ultra-high voltage resistance,low density and low dielectric properties. The material ...

Bergquist Gap Pad Tgp 7000ulm: FEATURES AND BENEFITS 1.Thermal Conductivity: 7 W/m-K 2.High-compliance, low compression stress 3.Ultra low modulus PRODUCT DESCRIPTIONA 7 W/m-K, extremely soft Gap Pad with exceptional thermal ...

Laird Tflex 600 Thermal Gap Filler: FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...

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