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Products > include a > Hothree Technology | Similar Products
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Loctite AA 3491

Loctite <strong>A</strong><strong>A</strong> 3491
a high, on-demand, curing speed. Depth of cure is 4 mm. Tack free time 15 secs. Fixturing time is 12 secs. Shore hardness: D 75. Medium viscosity 1,100 mPa·s.LOCTITE AA 3491 cures in seconds upon ...

Bergquist Hi-flow 565ut

Bergquist Hi-flow 565ut
a phase change softening, starting near 52°C. The phase change softening featureimproves handling characteristics prior to a facilitated assembly. At application temperatures andpressures, BERGQUIST ...

Loctite 315

Loctite 315
thermally sensitive components, while the controlled strength permits field and service repair. The self-shimming property produces a consistent 5-6 mil gap between the component and the heat sink. ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS

BERGQUIST G<strong>A</strong>P P<strong>A</strong>D VO Ultr<strong>a</strong> Soft G<strong>A</strong>P P<strong>A</strong>D TGP 1000VOUS
dampening and shockabsorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and ...

Bergquist Gap Filler Tgf 2000 GF2000

Bergquist G<strong>a</strong>p Filler Tgf 2000 GF2000
a result of thermal cycling and is dry to the touch. Unlike cured gap-filling materials, the liquid approach offers infinite thickness variations with little or no stress during displacement and ...

Bergquist Hi Flow Thf 500 Hi-Flow 625

Bergquist Hi Flow Thf 500 Hi-Flow 625
a thermal interface material between electronic power devices that require electrical isolation and a heat sink. The reinforcement makes Hi-Flow 625 easy to handle, and the 65°C phase change ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S

Bergquist SP900S Sil P<strong>a</strong>d 900s SIL P<strong>A</strong>D TSP 1600S
a smooth and highly compliant surface characteristic with high thermalconductivity. These features optimize the thermal resistance properties at low pressures.Applications requiring low component ...
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