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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0: BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II: BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electricallyconductive SIL PAD rubber. The material is designed for those applications in which ...

Bergquist Hi-flow 565ut: for ease of assembly BERGQUIST HI-FLOW THF 3000UT is a naturally tacky, thermally conductive phase change material which is supplied in an easy to use tabulated pad form. In the application the ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS: BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling PadGAP PAD TGP 1000VOUS, Silicone Thermal Pad For ConverterGAP PAD VO Ultra Soft Interface Pad Heat Transfer MaterialsBERGQUIST GAP PAD ...

Bergquist Gap Filler Tgf 2000 GF2000: for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won’t pump from the interface ...

Bergquist Gap Pad Tgp 7000ulm: interface. Protective liners are supplied on both sides allowing for ease of use.TYPICAL APPLICATIONS● Telecommunications (routers, switches, base stations) ● Optical transceivers ● ASICs and DSPs ...

Bergquist Sp1500st Sil-pad 1500st: BERGQUIST SP1500ST(Thermally Conductive Adhesive Tape) is a fiberglass reinforcedthermal interface material that is naturally tacky on both sides.BERGQUIST SIL-PAD 1500ST(Thermally Conductive ...

Laird Tflex 600 Thermal Gap Filler: FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...

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