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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0: requiring low stress on components and boards during assembly. BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable nature that allows for excellent interfacing ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS: dampening and shockabsorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and ...

Bergquist Gap Filler Tgf 2000 GF2000: with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. BERGQUIST GAP FILLER 2000 is intended ...

HSR-3500 Thermal Conductive Insulator: hothree HSR-3500 (thermal conductive insulator) is a pure boron nitride filled and has high thermal conductivity, ultra-high voltage resistance,low density and low dielectric properties. The material ...

Laird Tflex 600 Thermal Gap Filler: FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...

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