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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0: BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Bergquist Hi-flow 565ut: 52°C. The phase change softening featureimproves handling characteristics prior to a facilitated assembly. At application temperatures andpressures, BERGQUIST HI-FLOW 565UT wets out the thermal ...

Bergquist Gap Pad Tgp 7000ulm: out at the interface. Protective liners are supplied on both sides allowing for ease of use.TYPICAL APPLICATIONS● Telecommunications (routers, switches, base stations) ● Optical transceivers ● ASICs ...

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