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Products > pressurization > Hothree Technology | Similar Products

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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0: BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Bergquist Gap Filler Tgf 2000 GF2000: pressure like grease. After cure, it won’t pump from the interface as a result of thermal cycling and is dry to the touch. Unlike cured gap-filling materials, the liquid approach offers infinite ...

Bergquist Hi Flow Thf 500 Hi-Flow 625: of the coating material eliminates shipping and handling problems. The PEN film has a continuous use temperature of 150°C.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature ...

Bergquist Gap Pad Tgp 7000ulm: FEATURES AND BENEFITS 1.Thermal Conductivity: 7 W/m-K 2.High-compliance, low compression stress 3.Ultra low modulus PRODUCT DESCRIPTIONA 7 W/m-K, extremely soft Gap Pad with exceptional thermal ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S: The true workhorse of the SIL PAD product family, SIL PAD900S AC (BERGQUIST SP900S AC)thermally conductive insulation material is designed for a wide variety of applications requiring high thermal ...

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