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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0

Bergquist Gap <strong>Pad</strong> HC5.0  GAP <strong>PAD</strong>TGP HC5000 BERGQUIST GPHC5.0
requiring low stress on components and boards during assembly. BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable nature that allows for excellent interfacing ...

Bergquist Gap Pad Tgp 7000ulm

Bergquist Gap <strong>Pad</strong> Tgp 7000ulm
PAD TGP 7000ULM is an extremely soft gap filling material rated at a high thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly ...
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